Thick film hybrid microcircuit technology / D.W. Hamer, J.V. Biggers.
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Item type | Current library | Collection | Call number | Status | Date due | Barcode | |
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FCEQyN-Posadas | CG | 621.38 H214 (Browse shelf(Opens below)) | Available | 6336 |
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Chapter 1. Introduction to thick film microelectronics.-- Chapter 2. A first at thick film technology.-- Chapter 3.The economic rationale for thick film hybrids.-- Chapter 4. Thick film materials.-- Chapter 5. Screen printing.-- Chapter 6. Firing thick film.-- Chapter 7. Propertiers of thick film components.-- Chapter 8. Trimming thick film elements.-- Chapter 9. Bonding and soldering.-- Chapter 10.Discrete devices for thick film circuits.-- Chapter 11. Packaging.-- Chapter 12. Artwork , Layout and design.-- Chapter 13. The economics of Monolithic Integrated circuits and thin film integrated circuits.--
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